lcd panel cof data factory

COF Points Detect Data for LCD LED TV Panel Part 1 Very Soon Upload Parr2 for more details please visit our website. Subscribe our channel for more informat...

COF IC is the only IC that connects TV PANEL with the T-CON board physically. SO today in this article I will explain full information about COF IC and also tell you how to get and download COF IC datasheet. If you want to know the process of COF IC downloading, read this article very carefully.

You can not COF IC data from the official site of any number COF IC. You already know about me and here I’ll give you Panel COF data downloading link which I get while repairing. And if you do not get your COF data which you need to comment down below. I will update you on the COFdatasheet as soon as possible.

If you are an Electronics technician especially LCD/LED, Definitely you have to know about COF IC. How to work COF IC and working principle of this IC. Also you have to know the voltage value of this IC. If you are interested to know about COF IC voltage value click here and know how many types of voltage has present in this IC.

Every single panel have their own development and manufacturing COF IC. I make a video on this topic and post an article, If you want to see click here.

lcd screen bonding machine is used in a variety of FPC, COF, TAB and LCD Panel and PCB combination bonding, is reflected in a variety of sizes LCD vertical, horizontal, vertical band, horizontal belt, black belt, black, colored thread, ribbon , multi-line, black, black and white, vertical half display,horizontal half breakdown maintenance.

A variety of LCD problems, such as vertical, horizontal, black belt, the black line, the color line, ribbons, multi line, flower screen, black screen, white show, horizontal, vertical half and half fault, and so on.

The present invention relates to a chip-on-film (COF) tape, and more particularly to a composite packaged COF tape and a corresponding COF bonding method. BACKGROUND OF THE INVENTION

A liquid crystal display (LCD) is a type of flat panel display (FPD) which displays images by the properties of the liquid crystal material. In comparison with other display devices, the LCD has the advantages of being lightweight, compact, having a low driving voltage, and having low power consumption and thus has already become the mainstream product in the consumer market. In the traditional manufacturing process of an LCD panel, it comprises a front-end array process, a mid-end cell process, and a back-end modulation process. The front-end array process is used to produce thin-film transistor (TFT) substrates (also called array substrates) and color filter (CF) substrates; the mid-end cell process is used to combine the TFT substrate with the CF substrate, then fill liquid crystal into a space therebetween, and then they are cut to form panels compatible with a suitable product size; and the back-end modulation process is used to execute an installation process on the combined panel, a backlight module, a panel driver circuit, an outer frame, etc.

As mentioned above, LCD driver chips are important components of the LCD, and the main function thereof is to output the needed voltage to pixels, so as to control the twist degree of the liquid crystal molecules. There are two types of LCD driver chips: one is the source driver chip arranged on the X-axis, the other is the gate driver chip arranged on the Y-axis. In other words, the source driver chips control image signals, and the gate driver chips control gate switch signals, so they have different functions for the LCD panel. Simply speaking, images of an LCD are formed by scanning lines one by one. The gate driver chip controls the vertical signals. If the scanning is started from the topmost line, the first pin of the gate driver chip is set to be switched on, and the others are set to be switched off. The signals in the source driver chip are the real signal (horizontal), and the sent signal is only accepted by the horizontal pixels of the first line. After the signal of the first line is transmitted, the second line will be the next one, while the content of the source driver chip is changed to the second line, and the second pin of the gate driver chip is switched on, and the others are switched off, so that the data is transmitted to the second line.

Furthermore, the assembly of the driver chips of the back-end modulation process is an assembling technology which combines the packaged source driver chips and the packaged gate driver chip with the LCD panel. There are various packaging types of the driver chip for an LCD, such as quad fiat package (QFP), chip on glass (COG), tape automated bonding (TAB), chip on film (COF), etc. The COF structure has flexibility and smaller circuit pitches, so has become the mainstream technology of the package of driver chips.

Usually, a tape-packaged COF is processed by rolling and delivering in whole the tape, and in the traditional manufacture of an LCD panel, it is necessary to provide the above-mentioned COFs bonded to two edges thereof. Referring now to FIGS. 1A, 1B and 2, a top view of a traditional source COF tape is illustrated in FIG. 1A; a top view of a traditional gate COF tape is illustrated in FIG. 1B; and FIG. 2 is a schematic top view showing that the traditional source and gate COFs are bonded on a liquid crystal panel. Specially explaining, for conveniently describing, the above-mentioned figures are shown in simplification, wherein the number of traces is simplified, and some details which are unrelated to the explanation are also omitted.

As shown in FIG. 1A, a source COF tape 80 mainly comprises a base tape 80 aand a plurality of source COFs 81, wherein the source COFs 81 are arranged on the base tape 80 a,and by a plurality of punching processes the needed source COFs 81 can be cut from the base tape 80 aof the source COF tape 80.

As shown in FIG. 1B, a gate COF tape 90 mainly comprises a base tape 90 aand a plurality of gate COFs 91, wherein the gate COFs 91 are arranged on the base tape 90 a,and by a plurality of punching processes the needed gate COFs 91 can be cut from the base tape 90 aof the gate COF tape 90.

Moreover, as shown in FIG. 2, a liquid crystal panel 100 has a first side edge 110 and a second side edge 120 which are perpendicular to each other. By a plurality of processes of thermo-compression bonding the source COFs 81 can be bonded to the first side edge 110 of the liquid crystal panel 100, and the gate COFs 91 can be bonded to the second side edge 120 of the liquid crystal panel 100, so as to accomplish the assembly operation of the driver chips of the liquid crystal panel 100.

As described above, because the trend in developing LCD panels tends towards increasing the size of the panels, and the request for productivity is higher and higher, bonding two edges of an LCD at the same time has become a newly developing trend. However, it is necessary to provide both the above-mentioned source COFs 81 and the gate COFs 91. If the two different types of COF need to be provided simultaneously, it is necessary to prepare two sets of independent operating equipment, thus increasing the cost of the equipment.

As a result, it is necessary to provide a COF tape and a corresponding COF bonding method to solve the problems existing in the conventional technology. SUMMARY OF THE INVENTION

The present invention provides a composite packaged chip-on-film (COF) tape and a corresponding COF bonding method, which can solve the problems existing in the conventional technology: that the bonding operation of two types of COF can not be processed with a single tape and equipment at the same time.

To achieve the above object, the present invention provides a COF tape, which comprises: a base tape; a plurality of first COFs; and a plurality of second COFs; wherein the first COFs and the second COFs are arranged on the base tape.

In one embodiment of the present invention, in a cycle section of the COF tape, the number of the first COFs and the second COFs is corresponding to the number of the first COFs and the second COFs needed on a liquid crystal panel.

In one embodiment of the present invention, in the cycle section, n of the first COFs and n of the second COFs are arranged in alternation firstly, and then m of the first COFs are arranged thereafter.

providing a COF tape comprising a base tape, a plurality of first COFs and a plurality of second COFs, wherein the first COFs and the second COFs are arranged on the base tape, and then a part of the COF tape is pulled out;

providing a punching mechanism and a moving platform, wherein the punching mechanism comprises a first punching head and a second punching head which are disposed above the COF tape, and the moving platform is disposed under the corresponding COF tape, and the first punching head punches the corresponding first COFs onto the moving platform and/or the second punching head punches the corresponding second COFs onto the moving platform;

providing a liquid crystal panel having a first side edge and a second side edge perpendicular to each other; and providing a first bonding head and a second bonding head, wherein the first bonding head picks up the corresponding first COFs on the moving platform to bond onto the corresponding first side edge of the liquid crystal panel, and/or the second bonding head picks up the corresponding second COFs on the moving platform to bond onto the corresponding second side edge of the liquid crystal panel.

In one embodiment of the present invention, the steps of punching and bonding are repeated, so as to accomplish bonding operations of all of the first COFs and the second COFs of the liquid crystal panel.

In one embodiment of the present invention, in a cycle section of the COF tape, the number of the first COFs and the second COFs is correspond to the number of the first COFs and the second COFs needed on a liquid crystal panel.

In one embodiment of the present invention, in the cycle section, the number of the first COFs is n+m, and the number of the second COFs is n; and wherein n of the first COFs and n of the second COFs are arranged in alternation firstly, and then m of the first COFs are arranged thereafter.

In one embodiment of the present invention, according to an arranged situation of the first COFs and the second COFs on the COF tape, the first punching head and the second punching head can actuate alone or together, so as to punch the first COFs and/or the second COFs onto the moving platform.

In one embodiment of the present invention, according to a placed situation in which the first COFs and the second COFs are placed on the moving platform, the first bonding head and the second bonding head can actuate alone or together, so as to bond the first COFs and/or the second COFs onto the liquid crystal panel.

providing a COF tape comprising a base tape, a plurality of first COFs and a plurality of second COFs, wherein the first COFs and the second COFs are arranged on the base tape, and in a cycle section of the COF tape, the number of the first COFs is n+m, and the number of the second COFs is n; and wherein n of the first COFs and n of the second COFs are arranged in alternation firstly, and then m of the first COFs are arranged thereafter; and then the part of that n of the first COFs and n of the second COFs which are arranged on the COF tape is pulled out;

providing a punching mechanism and a moving platform, wherein the punching mechanism comprises a first punching head and a second punching head which are disposed above the COF tape, and the moving platform is disposed under the corresponding COF tape, and the first punching head punches the corresponding first COFs onto the moving platform and the second punching head punches the corresponding second COFs onto the moving platform;

providing a first bonding head and a second bonding head, wherein the first bonding head picks up the corresponding first COFs on the moving platform to bond onto the corresponding first side edge of the liquid crystal panel, and the second bonding head picks up the corresponding second COFs on the moving platform to bond onto the corresponding second side edge of the liquid crystal panel.

In one embodiment of the present invention, the foregoing steps are repeated, so as to accomplish bonding operations of the part of that n of the first COFs and n of the second COFs which are arranged on the COF tape.

picking up the corresponding first COFs on the moving platform by the first bonding head to bond onto the corresponding first side edge of the liquid crystal panel.

In one embodiment of the present invention, the foregoing steps are repeated, so as to accomplish bonding operations of the part of that m of the first COFs which are arranged on the COF tape.

Hence, the present invention provides a COF tape and a corresponding COF bonding method, wherein it can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, so as to lower the cost and increase the productivity. DESCRIPTION OF THE DRAWINGS

FIGS. 4A-4H are schematic views showing steps of that the COF tape is bonded on a liquid crystal panel according to the first preferred embodiment of the present invention;

FIGS. 6A-6C are schematic views showing the steps in which the COF tape is bonded on a liquid crystal panel according to the second preferred embodiment of the present invention.

Referring now to FIG. 3, which is a top view of a composite packaged chip-on-film (COF) tape according to a first preferred embodiment of the present invention. Specially explaining, for conveniently describing, the figures of the present invention are shown in simplification, wherein the number of traces is simplified, and some details which are unrelated to the explanation are also omitted.

As shown in FIG. 3, a composite packaged COF tape 10 mainly comprises a base tape 10 a,a plurality of first COFs 11, and a plurality of second COFs 12, wherein the first COFs 11 and the second COFs 12 are arranged on the base tape 10 ain a certain rule. In the preferred embodiment, the first COFs 11 and the second COFs 12 are alternately arranged on the base tape 10 a. Additionally, the pulled directions of the base tape 10 aof the COF tape 10 are shown by arrows in the figures of the present invention.

In FIG. 3, the first COF 11 can be a COF of a source driver IC, and the interior structures thereof are shown in simplification, and are not labeled. The first COF 11 comprises a flexible substrate, a driver chip, a plurality of output-side traces, and a plurality of input-side traces. The flexible substrate of the first COF 11 is provided with an output edge and an input edge. The output edge is connected with a liquid crystal panel (not shown), and the input edge is the side edge opposite to the output edge, which is connected with a circuit board (not shown).

In addition, the second COF 12 can be a COF of a gate driver IC, and the interior structures thereof are shown in simplification, and are not labeled. The second COF 12 comprises a flexible substrate, a driver chip, and a plurality of output-side traces. The flexible substrate of the second COF 12 is provided with an output edge. The output edge is connected with the liquid crystal panel (not shown).

Referring now to FIGS. 4A-4H, which are schematic views showing the steps in which the COF tape 10 is bonded on a liquid crystal panel according to the first preferred embodiment of the present invention. A COF bonding operation of the present invention, for example, is provided with an anisotropic conductive film (ACF) between the output edge of the COFs 11, 12 and contacts of the edge of the liquid crystal panel, and then the contacts of the output edge are electronically connected to the contacts of the liquid crystal panel by heating and pressing on the output edge, so as to accomplish a bonding action with the liquid crystal panel. The above-mentioned bonding method is also called thermo-compression bonding. However, the method for assembling COF onto the liquid crystal panel is not limited in the present invention. Other methods for assembling COF onto the liquid crystal panel can be adopted in the present invention.

The steps in which the COF tape 10 bonded onto a liquid crystal panel according to the first preferred embodiment of the present invention are described as follows:

Firstly, as shown in FIG. 4A, a COF tape 10 is provided, which comprises a base tape 10 a,a plurality of first COFs 11, and a plurality of second COFs 12, wherein the first COFs 11 and the second COFs 12 are alternately arranged on the base tape 10 a,and then part of the COF tape 10 is pulled out.

Then, as shown in FIGS. 4A and 4B, a punching mechanism 20 and a moving platform 30 are provided. The punching mechanism 20 comprises a first punching head 21 and a second punching head 22 which are disposed above the COF tape 10; and the moving platform 30 is correspondingly disposed under the COF tape 10. Then, as shown in FIG. 4B, the first punching head 21 punches the corresponding first COF 11 thereunder onto the moving platform 30, and the second punching head 22 punches the corresponding second COF 12 thereunder onto the moving platform 30 at the same time.

Then, as shown in FIG. 4C, the moving platform 30 is moved out to a certain position, which is preferably close to the next operating area. Then, as shown in FIGS. 4D and 4E, a liquid crystal panel 100 is provided. The liquid crystal panel 100 has a first side edge 110 and a second side edge 120 which are perpendicular to each other. Furthermore, a first bonding head 41 is provided. The first bonding head 41 picks up the corresponding first COF 11 on the moving platform 30 (as shown in FIG. 4D), and the first bonding head 41 bonds the corresponding first COF 11 onto the first side edge 110 of the liquid crystal panel 100 (as shown in FIG. 4E). Then, as shown in FIGS. 4F and 4G, a second bonding head 42 is provided. The second bonding head 42 picks up the corresponding second COF 12 on the moving platform 30 (as shown in FIG. 4F), and the second bonding head 42 bonds the corresponding second COF 12 onto the second side edge 120 of the liquid crystal panel 100 (as shown in FIG. 4G).

Lastly, as shown in FIG. 4H, the above-mentioned punching, moving and bonding steps can be repeated. In the preferred embodiment, because the numbers of the first COFs 11 and the second COFs 12 are the same, by repeating the above-mentioned punching, moving and bonding steps, the bonding operation of the other first COFs 11 and second COFs 12 onto the liquid crystal panel 100 is accomplished.

As described above, the COF tape 10 according to the first preferred embodiment of the present invention is a composite packaged COF tape 10, wherein the first COFs 11 and the second COFs 12 therein are arranged alternately on the base tape 10 a;the first COFs 11 and the second COFs 12 are punched onto the moving platform 30 by the punching mechanism 20; and the first COFs 11 and the second COFs 12 are bonded onto the two side edges of the liquid crystal panel 100 by the first bonding head 41 and the second bonding head 42 respectively. Therefore, the present invention can save the purchase cost of the COF tapes and the cost of related equipment. That is to say, it can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.

However, in a cycle section of the COF tape 10, the numbers of the first COFs 11 and the second COFs 12 thereof correspond to the numbers of the first COFs 11 and the second COFs 12 needed on the liquid crystal panel 100. Therefore, when the numbers of the first COFs 11 and the second COFs 12 needed on the liquid crystal panel 100 are different, it is necessary to adjust the numbers of the first COFs 11 and the second COFs 12 on a cycle section of the COF tape 10, their arranging order and following punching-bonding processes.

Referring now to FIG. 5, which is a top view of a composite packaged COF tape according to a second preferred embodiment of the present invention. The COF tape 10′ of the second embodiment is similar to the COF tape 10 of the first embodiment, thus using similar terms and numerals to the foregoing embodiment, the difference of this embodiment being that: in the COF tape 10′ of the second embodiment, the number of the first COFs 11 is greater than the number of the second COFs 12. For example, the number of the first COFs 11 is n+m; the number of the second COFs 12 is n. Therefore, there are two sections in a cycle section of the embodiment: in a first section, the numbers of the first COFs 11 and the second COFs 12 are the same, so that the first COFs 11 and the second COFs 12 are arranged alternately on the base tape 10 a(such as in the first preferred embodiment of the present invention); but in a second section, there are only m of the first COFs 11 on the COF tape 10′, that is, there are m of the first COFs 11 continually arranged on the COF tape 10′ after last second COFs 12. Hence, the COF tape 10′ of the second embodiment can insure that: in a cycle section thereof, the numbers of the first COFs 11 and the second COFs 12 exactly the same as the number of the first COFs 11 and the second COFs 12 needed on the liquid crystal panel 100′.

Referring now to FIGS. 6A-6C, which are schematic views showing the steps in which the COF tape 10′ is bonded on a liquid crystal panel according to the second preferred embodiment of the present invention. The steps in which the COF tape 10 is bonded onto a liquid crystal panel according to the second preferred embodiment of the present invention can be divided in two stages: in the first stage, because the numbers of the first COFs 11 and the second COFs 12 are the same, the same steps as that of FIGS. 4A-4F are adopted; but when the first stage is finished, it is necessary to process a bonding for the rest the first COFs 11 alone.

As shown in FIG. 6A, the first punching head 21 punches the first COF 11 thereunder onto the moving platform 30. At this moment, it is unnecessary to consider the second punching head 22 as corresponding to any of the second COF 12, and it does not process a punching action. Then, the moving platform 30 is moved out to a certain position.

As shown in FIG. 6B, the first bonding head 41 picks up the first COF 11 on the moving platform 30, and bonds the first COF 11 onto the first side edge 110′ of the liquid crystal panel 100′.

The above-mentioned punch-bonding steps can be repeated, until such time as the bonding operation of the first COFs 11 onto the first side edge 110′ of the liquid crystal panel 100′ is completed (as shown in FIG. 6).

The rule of how the first COFs 11 and the second COFs 12 are arranged on the COF tape 10 is not limited in the present invention. However, no matter what the arranging rule is, the corresponding punch-bonding steps are necessary. Moreover, if the interference between the first bonding head 41 and the second bonding head 42 on the moving platform 30 can be avoided, the first bonding head 41 and the second bonding head 42 can further take and bond the first COFs 11 and the second COFs 12 simultaneously.

That is to say, in the present invention, according to the situation in which the first COFs 11 and the second COFs 12 are arranged on the COF tape 10, 10′, the first punching head 21 and the second punching head 22 of the punching mechanism 20 can actuate alone or together, and punch the first COFs 11 and/or the second COFs 12 onto the moving platform 30. According to the situation in which the first COFs 11 and the second COFs 12 are placed on the moving platform 30, the first bonding head 41 and the second bonding head 42 can actuate alone or together.

In another words, in the present invention, the first punching head 21 punches the corresponding first COFs 11 onto the moving platform 30 and/or the second punching head 22 punches the corresponding second COFs 12 onto the moving platform 30; and the first bonding head 41 picks up the corresponding first COFs 11 on the moving platform 30 to bond onto the corresponding first side edge 110 of the liquid crystal panel 100, and/or the second bonding head 42 picks up the corresponding second COFs 12 on the moving platform 30 to bond onto the corresponding second side edge 120 of the liquid crystal panel 100.

As described above, a single traditional COF tape only provides one type of COF. If two different types of COF need to be provided simultaneously, it is necessary to prepare two sets of independent operating equipment, thus increasing the cost of the equipment. In the present invention, by providing of a composite packaged COF tape 10 which comprises a plurality of first COFs 11 and a plurality of second COFs 12 arranged alternately on the base tape 10 a, and by providing of a punching mechanism 20, a moving platform 30, and bonding heads 41 and 42, the first COFs 11 and the second COFs 12 are respectively bonded onto two side edges of a liquid crystal panel 100, and the action is repeated until the bonding operation of all of the first COFs 11 and the second COFs 12 of the liquid crystal panel 100 is completed. Therefore, the present invention can save the purchase cost of the COF tapes and the cost of related equipment, and it can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.

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This 5.5” COF OLED display with built-in SSD1322 controller IC has resolution of 256x64 pixels. There are some emitting colors to choose from, including yellow, green, white & support grayscale; it also offers interface options such as I2C, 6800, 8080. Its working temperature range is wide; it is from -40°C to + 80°C. This 5.5" OLED display can be used for industrial, medical and many other applications. ★Support Grayscale

It comes with sufficient film thickness that is not only flexible but can be easily used for any purpose. In addition to this, the panel repair factory COF IC possesses pretest capability which makes it in high demand for product fabrication applications.

It comes with sufficient film thickness that is not only flexible but can be easily used for any purpose. In addition to this, the panel repair factory COF IC possesses pretest capability which makes it in high demand for product fabrication applications.

Text: Flex LCD Custom Module COF UNIT WITH LCD EXAMPLE 2 2 PRODUCT INFORMATION SHARP COF , board ( COF ) capable of 0.38R bending. · Ultra thin module designs possible due to face down mounting , volume consumer electronics manufacturing, Sharp brings a breadth of expertise in the manufacture of custom LCD modules on flexible printed circuit boards. COF CUSTOM LCD MODULE Wide Variety of LCD , Sharp Japan Presentation, Issue Date: February 1998. Copyright ©1998, SHARP Microelectronics of the

Text: COF Unit with LCD <> Sharp "s unique thin-mounting technologies enable the thin , the COF (chip on FPC). Thin, single-piece design with LCD, COF and LCD backlight. [ IC thickness , time Line-ups and Applications Applications Types Basic Type LCD + COF (with peripheral circuits) With Backlight LCD + COF + Backlight Unit Type with Keyboard LCD + COF + Keyboard + Backlight NEW Unit Type with Touch Panel LCD + COF + Touch Panel + Backlight NEW CG-ROM Integrated

Text: on a single high-flexibility FPC. (2) With COF (Chip On FPC) directly connecting to a LCD, Sharp , graphic display capabilities. Sharp "s newly developed "CG-ROM integrated COF unit with LCD" satisfies , COF UNIT WITH LCD COF UNIT WITH LCD FOR HANDY EQUIPMENT S DISPLAY software between LCD driver , , using communication soft (between LCD driver control and MPU) and V d d 3.0 supply. (4) COF module meets , c o n tro l IC a n d b a c k lig h t ke y. I CG-ROM INTEGRATED COF UNIT WITH LCD B Item s

Text: \ chip bottom view Note: This layout does not restrict the outer dimensions of the COF . SHARP LR0G904,  SHARP 1 SPEC No. 904-1-1 ISSUE:Oct. 27. 1999 SPECIFICATIONS Product Type:_LCD Module Model , GROUP SHARP CORPORATION SHARP 2 RECORDS OF REVISION SPEC No. 904-1-1 MODEL No. LR0G904 DOC , herein and from the industrial property of any third party. SHARP LR0G904 0-2 «Notes on assembly , taken to such storage material. SHARP 0-3 LR0G904 <6> Others This LCD module is laminated to

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Text: UC1607 128x128/4S Matrix LCD Controller-Drivers UC1607(i) Single-Chip, Ultra-Low Power Passive Matrix LCD Controller-Driver modulation scheme. Sharp image and ultralow power consumption under all display patterns. INTRODUCTION UC1607(i) is an advanced high-voltage mixedsignal CMOS IC, especially designed for the display needs of ultra-low power hand-held devices. · Support four , COF package 128 COM x 128 SEG LCD driver, with I C interface license. UC1607xFAB COF package 128

Abstract: Single Phase Energy Meter Analog Devices Single Phase Energy Meter energy meter single phase single phase reactive power meter Xiamen Ocular energy meter circuit diagram 3 phase MCP3909 application note MCP3909 xiamen lcd DP076P

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Abstract: kvar schematic DS51964 DP076P PIC microcontroller 3 phase energy meter smd diode code pj 38 PIC18F87J72 1A 220v led 3.3v on-line calibration of data in energy meter power MAX3232 smd

Text: Design 3.6 LINE_CYC Name Bits Cof 16 R/W LINE_CYC Number of line cycles as a power , LINE_CYC_CNT Name Bits Cof 16 R LINE_CYC_CNT This register counts from 0 and finishes at 2 , RAW2_I_RMS Name RAW2_I_RMS Bits Cof 64 R This register is the square of the raw RMS value , RAW_I_RMS Name Bits Cof RAW_I_RMS 16 R This register is the raw RMS value from the , 3.10 I_RMS Name I_RMS Bits Cof 16 R This register is the RMS value of phase A

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Text: . Features COF New film package design created from SHARP "S TCP technology .This highly flexible film , thickness (TYP). SHARP can meet special customer requirements depending on the circuits. Surface-mount chips , small module can be created by using Sharp "s original COB mounting technique. 2. Highly reliable , -pin (Package size; 16 mm x 16 mm. Pin pitch; 0.8 mm) Structure of SHARP CSP(FBGA) S tack ed P ackag e S , Resin ·Features Mounting area : Approximately 1/3 (in comparison with using the SHARP "S two TSOPs

Text: PREPARED BY: APPROVED BY: DATE SHARP DATE LIQUID CRYSTAL DISPLAY GROUP SHARP , DUTY LCD DEVIXLOPIVIENT CENTER DUTY LIQUID CRYSTAL DISPLXY GROUP SHARP CORPORATION 1 SPEC SHARP MODEL No. No. LM024LB LC99YO5 PAGE 1 1 SO 1 (Precautions) 1) Do not , ) of and SPEC SHARP the LCD module material If the LCD module of revert , between contact of these SPEC SHARP MODEL No. LC99YO5(Precautions 1) Do not

Abstract: kwh meter mcp3905 MCP3909 PIC18f4550 assembly programming RS-232 to usb converter with pic18f4550 SCT220B MCP390X MCP3909 application note SCHEMATIC 12 to 220v inverter 200w pic18f4550 mplab c18 project lcd

Text: REGISTER 3-1: Name Bits Address Cof MODE1 16 0x000 R/W The mode register controls , : Name Bits Address Cof STATUS1 16 0x004 R The STATUS1 register contains the , Name Bits Address Cof CAL_CONTROL 16 0x008 R/W This is the calibration mode , Cof LINE_CYC 16 0x00A R/W Number of line cycles as a power of two. A setting of 0 , : LINE_CYC_CNT REGISTER Name Bits Address Cof LINE_CYC_CNT 16 0x00C R This register

Text: Address Cof 0x000 R/W The mode register controls the operation of the energy meter. The bit , Register STATUS1 Register REGISTER 3-2: Name Bits Address Cof STATUS1 16 0x004 R The , REGISTER 3-3: CAL_CONTROL Register Name Bits Address Cof CAL_CONTROL 16 0x008 R , Design 3.4.4 LINE_CYC REGISTER 3-4: LINE_CYC REGISTERS Name Bits Address Cof , REGISTER Name Bits Address Cof LINE_CYC_CNT 16 0x00C R This register counts from

Abstract: datasheet capacitor 2200uf bvy10 power amplifier circuit diagram with pcb layout BVY10-40 60268 MKT 0.1K 2200uF CAPACITOR capacitor 1000uF 16V TDA1565

Text: Cvp 2200uF Cof 22uF Ground track Ground connection Power supply PCB Ground of probe , grounding and a poor grounding Cvp 2200uF Cof 22uF Ground track PCB Ground plane Ground loop , Cof 22uF No Ground loop · In spite of the fact that this amplifier has differential inputs , load. 31 Sharp

Abstract: LPC2148 LPC2148 i2c NXP lpc2148 PCA9620 PCF85176 NXP LCD graphic LCD lpc2148 dot led display large size with circuit diagram GRAPHICAL LCD DIAGRAM

Text: for chip-on-flexfoil ( COF ) } Add PCA9633 RGB LED driver for LED backlighting in any color , display more text, and ensure that fonts are sharp and easy to read, with almost invisible pixels. Key , , and ensure that fonts are sharp and easy to read, with almost invisible pixels. Key features , , and ensure that fonts are sharp and easy to read, with almost invisible pixels. Key features , chip-on-glass (COG) modules - Bumped die for chip-on-flexfoil ( COF ) } Add PCA9633 RGB LED driver for LED

Abstract: BSO 22 silicone amine booster pump 13 pin lcd display graphical lcd 128X64 sharp lcd 128 240 128X64 LD50 LM024LB1S01 Liquid Crystal Display Graphic Module

Text: PREPARED BY: DATE APPROVED BY: DATE LIQUID CRYSTAL DISPLAY GROUP SHARP CORPORATION , DEVELOPMENT CENTER DUTY LIQUID CRYSTAL DISPLAY GROUP SHARP CORPORATION SPEC No. LC99Y05 MODEL No. LM024LB1, the contact of these two. fri_■at. SPEC No. MODEL No. PAGE SHARP LC99Y05 LM024LB1S01 3 , , 2 time voltage pump up, 11 line alternation. Please see the specifications of LH155BG( SHARP ) for the details of the electrical functions. 2.Construction ana Outline Construction: LCD panel - COF

Text: SSD0323 COF /ZIF Product Specification for HX2XX Full Moon OLED Module, 96X64, SSD0323, /Controller 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 I/F FPC COF Row Driver 96 x 64 OLED , bare fingers, pay special attention to sharp glass edges to avoid potential injury. Avoid touching Flex , with care. Avoid hard or sharp objects in contact with the display surface. Store and operate the OLED

Text: 16 17 V5 R53 11K 1 20 R54 22K COF .1u;50V 3 1 19 ROFA 500K ROFB , J10 1 2 JUMPER 24 OVRLDB Y2B VHI Y1B 25 COF .1u;50V 26 ROFA 500K , FDBKP1 MUTE 6 V5 JUMPER COF .1u;50V 3 BBM2 BBM1 VPWR VP2 FDBKN2 IN2 5 , measurement instrument used. Unless the filter has a very sharp roll-off just beyond the audio band or the

Abstract: PC1602-v PC1602V VGG804805-6UFLWA 7 inch 800x480 LCD panel PG12864-F NL160120BC27-14 S6B0108B NL10276BC13-01C lcd touchscreen elo inverter board

Text: · · Hitachi Displays NEC Electronics Sharp Microelectronics LCDs have become an , Modules ­ GSM/GPRS, UMTS, Bluetooth, Wireless LAN, ZigBee, GPS, Antennas Introduction Sharp , . www.arroweurope.com 1 SHARP Competitive edge through LCD technology Numerous technologies have opened up a wide range of applications for Sharp displays: from small-format VGA TFTs for mobile applications , , industrial and e-Signage segment. Thanks to special features, Sharp displays are also suitable for use

Text: TC2000 RREF 8.2K 15 16 17 V5 R53 11K 1 20 R54 22K COF .1u;50V 3 1 19 , V5 25 COF .1u;50V 26 ROFA 500K RF 20K 27 28 + 13 12 Y2 11 Y2B 10 , RFBC 14K;1% 4 RI 20K CI 2.2u;10V 2 Y2 11 V5 JUMPER COF .1u;50V 3 1 , of the measurement instrument used. Unless the filter has a very sharp roll-off just beyond the

Text: m lu , C E L íS LL in nLL I SYMBOL ) ëg <8>- IN(13:0) GAIN ADJ (2 : 0) COF SOF , the Buffer RAM Output Port. See Output Section. DESCRIPTION PROCCLK I AGCGNSEL COF I I , ri> COF COFSYNC (CARRIER TRACKING) SOF SOFSYNC REFCLK Hi n II C n0 ) (co = i; = iirr NCO , is achieved with 0.012Hz resolution frequency control of the NCO and the sharp filter responses

TAB COF IC supplier in India. Panel Repair Factory is the biggest COF IC Dealer worldwide. We have the largest COF IC stock in the world with around 1500 different COF IC, COF IC supplier in Delhi, COF IC Dealer in India

Panel repair factory is one of the top COF IC suppliers. COF stands for Chip on film. Each of them comes with a wide range of features and specifications. The COF IC supplied by panel repair factory is capable of receiving Signals and digital data and in turn, reversing it into analogue signals which are then sent to the receiver device. The COF IC is commonly used in LCD TVs and O LED devices. It is capable of high accuracy and ensures panel pixel uniformity. It is highly useful in the interconnection of the LCD driver ICs. It comes with sufficient film thickness that is not only flexible but can be easily used for any purpose. In addition to this, the panel repair factory COF IC possesses pretest capability which makes it in high demand for product fabrication applications. It combines the power of interconnection Technology that covers all the needs of LCD panel applications that feature high resolution. It is suitable for use with all electronic products whether they are lightweight or heavyweight.With it, you can easily package IC chips of any dimension. It is also capable of packing multiple chips and passive components within its circuit films.