tft lcd glass substrate factory

(Yicai Global) June 19 -- China National Building Material has built the country"s first production line capable of producing 8.5th-generation TFT-LCD glass substrates, making China one of few nations to master the technology.

The central state-owned firm"s Bengbu Glass Industry Design and Research built the facility after three years of research, Science and Technology Daily reported. The plant aims to obtain certifications that will allow it to manufacture for domestic display makers.

TFT-LCD, or thin-film-transistor liquid-crystal displays, are classified by the size of their glass substrate. Sixth-generation displays are now widely considered out-dated while 8.5th-gen tech is the most advanced. The newer technologies use larger substrates, which are more efficient to make and can be used in larger screens.

Demand for glass substrates in China reached 260 million square meters in 2018, with demand for 8.5th-gen components making up 233 million, according to the China Optics & Optoelectronics Manufacturers Association. But domestic production is only about 40 million square meters and all below 6th-gen. American and Japanese companies mostly dominate the more advanced segment of the market.

Asahi Glass, Co., Ltd. (Headquarters: Tokyo; President: Shinya Ishizu) decided to increase its manufacturing capacity of glass substrates used for TFT-LCD (Thin Film Transistor Liquid Crystal Display). With this increase the company will install new furnace of glass substrate at its Kansai factory and augment its glass panel polishing line in Taiwan. Engineering will commence from August of this year and is expected to be completed in October, 2003. Total funds to be injected into the project are estimated at 17 billion yen. The total production capacity as a result of this increase is estimated to be 10 million square meters annually, using four furnaces of glass substrates.

The demand for TFT-LCD displays is predicted to increase at a rate of 30% annually through the year 2005, since a steady increase is predicted not only for their use in notebook PCs, but even more so for their use in PC monitors. Their use in TVs is also expected to sky rocket. In addition, TFT-LCD substrate panel manufacturers announce they plan to use the large substrates to reduce their cost, and that in the future the "5th Generation Size" of glass substrates with a surface are exceeding one square meter, will be the industry mainstay.

Unlike many competitors, Asahi Glass incorporates floating method in manufacturing process of the glass substrates, which is suited to the mass production of large size. The company decided to increase the manufacturing capacity of its TFT-LCD glass substrates because it felt that the increasing demand for TFT-LCD displays and calls for larger glass substrates for TFT-LCD displays presented a great opportunity to further expand this business area and become the global leader in the impending. Details of the future capacity increase are as follows:

We will install the fourth furnace of TFT-LCD glass substrate at the Kansai Factory (Amagasaki City, Hyogo Prefecture). The new furnace will enable highly efficient multi-line production of ultra-large-sized substrates, primarily ultra-large glass substrates larger than one square meter, making possible the manufacture of glass substrates of approximately four meters in width. The manufacturing capacity of this furnace is four million square meters annually, nearly twice that of our existing furnaces, and requires a capital investment of roughly 12 billion yen.

We will augment the TFT-LCD glass panel polishing line, which is targeted for the fifth generation size glass substrate, at Asahi Glass Fine Techno Taiwan Co., Ltd. (a fully owned subsidiary of Asahi Glass, Co., Ltd., located in Douliu City, Taiwan), which has been operating a polishing line since 2001. Capital investment for the new line is roughly five billion yen. Although Asahi Glass Fine Techno in Japan (a fully owned subsidiary of Asahi Glass, Co., Ltd., located in Yonezawa City, Yamagata Prefecture) also conducts polishing of TFT-LCD glass substrates, the line addition will be made in Taiwan, since future production volumes of TFT-LCD substrates will greatly increase there and since it is expected that Taiwanese TFT-LCD panel manufacturers will employ the 5th generation size of glass substrate before manufacturers in Japan do.

We will fully leverage the features of the float method, which is especially suited for larger glass substrates, to address increasing demand and proceed with the expansion of the TFT-LCD glass substrate business.

We are the only glass manufacturer in the world employing the float method in the manufacturing process of TFT-LCD glass substrates. Produced using this method and brought to market in 1998, our "AN100" product exhibits the following major features:

The "AN100" comes fully equipped with the qualities sought after in the future TFT-LCD industry"s 5th generation line of large glass substrate (one square meter or larger), and is very highly regarded by our customers.

Our "AN100" is an environmental friendly product. In fact, it is the only non-alkaline glass substrate used in TFT-LCD displays that does not use the harmful substances known as Arsenious Acid (As2O3) and Antimony (Sb2O3) in the manufacturing process.

The glass substrate is one of the core layers of TFT LCD. It influences fundamental features of the display in the resolution, light transmittance, thickness, weight, and viewing angle.

The glass substrate is the core component of the TFT LCD and plays a significant role in the upstream of the TFT LCD industry, similar to the silicon wafer in the semiconductor industry.

Since the quality of the glass substrate decides the features of the display in the resolution, light transmittance, thickness, weight, viewing angle, and other important parameters.

The fundamental structure of the TFT LCD is similar to a sandwich, two layers of “bread” (TFT substrate and color filter) sandwiched with “jam” (liquid crystal).

Considering the unique environment in the manufacturing process of TFT-LCD, such as high temperature, high pressure, and environment switching among acidic-neutral-alkaline, the following characteristics of the glass must meet the challenge and quality requirement.

In the manufacturing process, the maximum temperature can reach above 600 ℃, which requires the glass substrate to remain rigid without any sticking even at such a high temperature.

After the etching process, the glass substrate needs to remain with minimal changes, and can’t be left with visible residue and interference with film deposition.

In the process the mother glass is cut into pieces in the required size, with a thickness of only 0.5-0.7mm, the glass needs to have high mechanical strength and elastic modulus >70GPa.

Usually, the size has doubled with each successive generation. From the initial generation 4 (G4) to the current G11, the size of the substrate has grown to 3000*3320mm.

In the global market of glass substrates for TFT-LCD, more than 90% are concentrated in several major manufacturers, such as Corning (America), Asahi Glass (Japan), Nippon Electric Glass (Japan), and AvanStrate (Taiwan).

However, there is still a gap and need for breakthroughs in the glass for high-generation LCD panel production lines and AMOLED alkali-free glass technology. It is hard to achieve high localization in a short time.

One of the industry’s leading oxide panel makers selected Astra Glass as its backplane glass substrate because it has the inherent fidelity to thrive in high-temperature oxide-TFT glass fabrication for immersive high-performance displays.

One of the industry’s leading oxide panel makers selected Astra Glass as its backplane glass substrate because it has the inherent fidelity to thrive in high-temperature oxide-TFT glass fabrication for immersive high-performance displays.

The global TFT LCD Glass Substrate market size is projected to reach multi million by 2028, in comparision to 2021, at unexpected CAGR during 2022-2028 (Ask for Sample Report).

The TFT LCD Glass Substrate has several applications, including: Television,Laptop & Tablet,Desktop Monitor,Automotive,Mobilphone,Other. Based on types these are segmented in Gen. 5,Gen. 6,Gen. 7,Gen. 8. The market for TFT LCD Glass Substrate is highly competitive. There are several major market players in the market, including Corning,AGC,NEG,Tunghsu Optoelectronic,AvanStrate,IRICO,LG Chem. The report provides an expansive market geographical regions analysis by covering areas like North America: United States, Canada, Europe: GermanyFrance, U.K., Italy, Russia,Asia-Pacific: China, Japan, South, India, Australia, China, Indonesia, Thailand, Malaysia, Latin America:Mexico, Brazil, Argentina, Colombia, Middle East & Africa:Turkey, Saudi, Arabia, UAE, Korea.

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TFT-LCD was invented in 1960 and successfully commercialized as a notebook computer panel in 1991 after continuous improvement, thus entering the TFT-LCD generation.

Simply put, the basic structure of the TFT-LCD panel is a layer of liquid crystal sandwiched between two glass substrates. The front TFT display panel is coated with a color filter, and the back TFT display panel is coated with a thin film transistor (TFT). When a voltage is applied to the transistor, the liquid crystal turns and light passes through the liquid crystal to create a pixel on the front panel. The backlight module is responsible for providing the light source after the TFT-Array panel. Color filters give each pigment a specific color. The combination of each different color pixel gives you an image of the front of the panel.

The TFT panel is composed of millions of TFT devices and ITO (In TI Oxide, a transparent conductive metal) regions arranged like a matrix, and the so-called Array refers to the region of millions of TFT devices arranged neatly, which is the panel display area. The figure below shows the structure of a TFT pixel.

No matter how the design of TFT display board changes or how the manufacturing process is simplified, its structure must have a TFT device and control liquid crystal region (if the light source is penetration-type LCD, the control liquid crystal region is ITO; but for reflective LCD, the metal with high reflection rate is used, such as Al).

The TFT device is a switch, whose function is to control the number of electrons flowing into the ITO region. When the number of electrons flowing into the ITO region reaches the desired value, the TFT device is turned off. At this time, the entire electrons are kept in the ITO region.

The figure above shows the time changes specified at each pixel point. G1 is continuously selected to be turned on by the driver IC from T1 to TN so that the source-driven IC charges TFT pixels on G1 in the order of D1, D2, and Dn. When TN +1, gATE-driven IC is selected G2 again, and source-driven IC is selected sequentially from D1.

Many people don’t understand the differences between generations of TFT-LCD plants, but the principle is quite simple. The main difference between generations of plants is in the size of glass substrates, which are products cut from large glass substrates. Newer plants have larger glass substrates that can be cut to increase productivity and reduce costs, or to produce larger panels (such as TFT display LCD TV panels).

The TFT-LCD industry first emerged in Japan in the 1990s, when a process was designed and built in the country. The first-generation glass substrate is about 30 X 40 cm in size, about the size of a full-size magazine, and can be made into a 15-inch panel. By the time Acer Technology (which was later merged with Unioptronics to become AU Optronics) entered the industry in 1996, the technology had advanced to A 3.5 generation plant (G3.5) with glass substrate size of about 60 X 72 cm.Au Optronics has evolved to a sixth-generation factory (G6) process where the G6 glass substrate measures 150 X 185 cm, the size of a double bed. One G6 glass substrate can cut 30 15-inch panels, compared with the G3.5 which can cut 4 panels and G1 which can only cut one 15-inch panel, the production capacity of the sixth generation factory is enlarged, and the relative cost is reduced. In addition, the large size of the G6 glass substrate can be cut into large-sized panels, which can produce eight 32-inch LCD TV panels, increasing the diversity of panel applications. Therefore, the global TFT LCD manufacturers are all invested in the new generation of plant manufacturing technology.

The TRANSISTor-LCD is an acronym for thin-film TFT Display. Simply put, TFT-LCD panels can be seen as two glass substrates sandwiched between a layer of liquid crystal. The upper glass substrate is connected to a Color Filter, while the lower glass has transistors embedded in it. When the electric field changes through the transistor, the liquid crystal molecules deflect, so as to change the polarization of the light, and the polarizing film is used to determine the light and shade state of the Pixel. In addition, the upper glass is fitted to the color filter, so that each Pixel contains three colors of red, blue and green, which make up the image on the panel.

– The Array process in the front segment is similar to the semiconductor process, except that thin-film transistors are made on glass rather than silicon wafers.

– The middle Cell is based on the glass substrate of the front segment Array, which is combined with the glass substrate of the color filter, and liquid crystal (LC) is injected between the two glass substrates.

-The rear module assembly process is the production operation of assembling the glass after the Cell process with other components such as backlight plate, circuit, frame, etc.

The organic light display can be divided into Passive Matrix (PMOLED) and Active Matrix (AMOLED) according to the driving mode. The so-called active driven OLED(AMOLED) can be visualized in the Thin Film Transistor (TFT) as a capacitor that stores signals to provide the ability to visualize the light in a grayscale.

Although the production cost and technical barriers of passive OLED are low, it is limited by the driving mode and the resolution cannot be improved. Therefore, the application product size is limited to about 5″, and the product will be limited to the market of low resolution and small size. For high precision and large picture, the active drive is mainly used. The so-called active drive is capacitive to store the signal, so when the scanning line is swept, the pixel can still maintain its original brightness. In the case of passive drive, only the pixels selected by the scan line are lit. Therefore, in an active-drive mode, OLED does not need to be driven to very high brightness, thus achieving better life performance and high resolution.OLED combined with TFT technology can realize active driving OLED, which can meet the current display market for the smoothness of screen playback, as well as higher and higher resolution requirements, fully display the above superior characteristics of OLED.

The technology to grow The TFT on the glass substrate can be amorphous Silicon (A-SI) manufacturing process and Low-Temperature Poly-Silicon (LTPS). The biggest difference between LTPS TFT and A-SI TFT is the difference between its electrical properties and the complicated manufacturing process. LTPS TFT has a higher carrier mobility rate, which means that TFT can provide more current, but its process is complicated.A-si TFT, on the other hand, although a-Si’s carrier movement rate is not as good as LTPS’s, it has a better competitive advantage in cost due to its simple and mature process.Au Optronics is the only company in the world that has successfully combined OLED with LTPS and A-SI TFT at the same time, making it a leader in active OLED technology.

Polysilicon is a silicon-based material about 0.1 to several um in size, composed of many silicon particles. In the semiconductor manufacturing industry, polysilicon should normally be treated by Low-Pressure Chemical Vapor Deposition. If the annealing process is higher than 900C, this method is known as SPC. Solid Phase Deposition. However, this method does not work in the flat display industry because the maximum temperature of the glass is only 650C. Therefore, LTPS technology is specifically applied to the manufacture of flat displays.

The LTPS membrane is much more complex than a-SI, yet the LTPS TFT is 100 times more mobile than A-SI TFT. And CMOS program can be carried out directly on a glass substrate. Here are some of the features that p-SI has over A-SI:

2. Vehicle for OLED: High mobility means that the OLED Device can provide a large driving current, so it is more suitable for an active OLED display substrate.

3. Compact module: As part of the drive circuit can be made on the glass substrate, the circuit on the PCB is relatively simple, thus saving the PCB area.

LCD screens are backlit to project images through color filters before they are reflected in our eye Windows. This mode of carrying backlit LCD screens, known as “penetrating” LCD screens, consumes most of the power through backlit devices. The brighter the backlight, the brighter it will appear in front of the screen, but the more power it will consume.

Different from the traditional manufacturing process, COG technology directly assumes the drive IC on the glass substrate. The advantages of this technology include:

Recently, the Bengbu Glass Industry Design and Research Institute Holdings subsidiary, Chengdu Optoelectronics Technology Co., Ltd. production of the first ultra-thin 0.5mm the arsenic TFT-LCD glass substrate products passed the domestic core users - Tianma Microelectronics batch certification, and officially subsequent bulk purchases orders, successfully open up the market.

Generally, LCDs are filled with a liquid crystal layer with a thickness of about 3~4um between the upper and lower transparent electrodes, and the electric field of the liquid crystal interlayer is controlled by the method of filling the pixel electrode voltage, and then the intensity of the transmitted light is adjusted to produce a full brightness. Gray level between and full darkness. At present, LCD is mainly composed of three parts: color filter (CF), TFT array (TFT Array) substrate and backlight module (Backlight) as shown in Figure 1 (a). Each Pixel of TFT-LCD has a set of TFTs to control its voltage value, and to make the light generated by the backlight module and transmitted through the LC have different colors, red, blue, and green (R/B/G) are needed. Three colors of color resist are formed on the CF glass, and the gray scales are used to produce a full-color effect; after the TFT array and the CF substrate are respectively completed, then the CF upper plate and the TFT lower plate are filled with LC and bonded together. Finally, attach the polarizer. This process is called the "LCD process"; and the final "LCM process" is the connection between the driver IC and the control circuit board (PCBA) and the glass substrate (JI Process). Assemble with the backlight module (MA Process), and finally the lighting detection of the module... and so on as shown in Figure 1 (b).

AU Optronics (hereinafter referred to as AU Optronics) has developed a process above the 8.5 generation factory to produce large-size LCD TV panels (see Figure 2). In December 2008, AUO successfully lighted the first 46-inch LCD TV panel produced in the G8.5 plant in China. The process technology once again led the whole Taiwan, marking a new page in the milestone of the new generation of TFT-LCD plant. Also established a new model of TFT-LCD green plant. The size of the G8.5 glass substrate is equivalent to the size of a pool table, but the thickness of the glass is less than 1mm. Therefore, the new-generation plant requires higher process technology; as the technology of large-size panels gradually matures, AUO will still Continue to focus on the development of new-generation plants, and continue to advance with the goal of increasing production capacity, improving process quality, and targeting customer service.

The development direction of next-generation process technology is nothing more than simplifying the process and selecting optimized raw materials and components to increase process yield and productivity, and reduce production costs. The capital investment of the front-end TFT Array and CF process equipment accounts for more than 60% of the total TFT-LCD expenditure. Therefore, the front-end process research and development first focuses on simplifying the process and improving the utilization of raw materials: for example, the four-pass mask technology that simplifies the mask process ( See Figure 3 (a)) and the pattern forming method without exposure and etching. In addition, the use of thinned glass substrates not only reduces the consumption of glass raw materials, but also has the advantages of lighter weight and thinner products; at the same time, it can achieve the goals of energy saving and waste reduction such as reducing packaging materials and improving transportation efficiency. As for LCM, with the rapid development of gate drive circuit substrate technology (Gate on Array, GOA) and HSD (Half source driving) technology in Figure 3 (b), it has not only simplified the material dependence of traditional panels on a large number of driver ICs. , Also contributes to the increase of LCM production capacity. In terms of module backlights, replacing traditional cold cathode tubes with light-emitting diodes (Light Emitting Diode, LED) not only avoids the harm of mercury (Hg) vapor in the tubes to the environment; the better luminous efficiency of LEDs also makes the products more efficient Energy saving.

Realize that goal of the invention technical scheme of the present invention is: this production line of the present invention is after glass substrate forming annealing, come out through cutting from annealing furnace, grind, check, packing, to the processing whole process of producing finished product, according to process characteristics and zone, be divided into three work areas according to the operation setting, be followed successively by the annealing furnace end region, the post-treatment district, the test package district, three work areas are connected formation whole piece TFT-LCD glass substrate production line successively, be made as to be interrupted and be connected by manually transporting equipment between annealing furnace end region and the post-treatment district, be made as directly by automatic conveying equipment between post-treatment district and the test package district and be connected; Wherein the annealing furnace end region comprise be disposed with transverse cutting unit, load units, supply unit, weighting unit, rip cutting unit, verification unit, go up the paper unit, packaging unit constitutes, the terminal workspace of annealing furnace constitutes a whole set of sealing working cycle system, each working cell is connected successively, its supply unit connects each working cell thereafter and is loop structure, and each equipment of annealing furnace end region is realized the united and coordinating running by the electrical apparatus control system of supporting setting; The post-treatment district comprises the load units that sets gradually, gets paper unit, supply unit, transposable element, scribing unit, breaks disconnected unit off with the fingers and thumb, grinding unit, cleaning unit constitute, each working cell is connected successively, its supply unit connects each working cell thereafter, and each equipment of post-treatment district is realized the united and coordinating running by the electrical apparatus control system of supporting setting; The test package district comprises that supply unit, temporary storage location, verification unit, the unloading unit that sets gradually, the finished product packing unit of finishing the finished product packing constitute, each working cell is connected successively, its supply unit connects each working cell thereafter, and each equipment of test package district is realized the united and coordinating running by the electrical apparatus control system of supporting setting.

The transverse cutting unit is mainly the standard equipment transverse cutting unit in the terminal workspace of annealing furnace of the present invention; Load units is mainly standard equipment and loads the robot device; Supply unit is to be conventional equipment for the automated cycle transmission system; Weighting unit is mainly special-purpose vertical Weighing device automatically; The rip cutting unit mainly comprises the standard equipment slitter; Verification unit is mainly the work in-process automatic checking system; Last paper unit is mainly the special-purpose paper robot of going up; Packaging unit comprises the standard equipment unloading robot and the simple and easy base plate glass packed and transported case of supporting setting.The vertical weighing device concrete structure of above-mentioned special use is: comprise the bed frame of weighing, be provided in the vertical fastening bracket of the glass mechanism on the bed frame and the electronic balance of weighing from top to bottom successively, and the electric control system of the power system of supporting setting and each parts coordinate operation of control.Described vertical fastening bracket mechanism comprises that then the bracket base, Mobile Slide, clamping crossbeam, mobile scale, the clamp arm of weighing, the chuck of weighing, the lifting location that are assembled together lift mechanism.Described bracket base is fixedly installed on the carriage of the electronic balance of weighing, on bracket base, be equipped with the clamping crossbeam of pair of parallel by Mobile Slide, the slide block of Mobile Slide seesaws with clamping crossbeam, and the guide rail of Mobile Slide is fixed on the bracket base; Be provided with the clamp arm of weighing in a pair of clamping crossbeam two ends pairings, supportingly on the paired clamp arm of weighing in carriage mechanism two ends be provided with the paired chuck of weighing, the lifting location is lifted mechanism and fixedly is provided on the bracket base, is equipped with mobile scale at the clamping crossbeam; The electronic balance of weighing is fixed on the bed frame.The described chuck of weighing adopts the silicon rubber chuck that can realize flexible contact, and the lifting location lifts the mechanism top and the glass contact position is provided with the silicon rubber pad.Preferably set Moving caster and adjust lower margin in the bed frame bottom of weighing.In the above-mentioned special use at interval the robot of paper comprise robot body"s frame, robot VTOL (vertical take off and landing) transfer assembly, the horizontal transfer assembly of robot and robot arm and constitute that wherein robot VTOL (vertical take off and landing) transfer assembly is assemblied in and comprises the fixed support mechanism that is contained on the main frame on the main frame, is assemblied in vertical shifting transfer mechanism and the supporting vertical servomotor mechanism that is arranged on regulation and control vertical shifting transfer mechanism in the fixed support mechanism in the fixed support mechanism; The horizontal transfer assembly of robot is assemblied in robot VTOL (vertical take off and landing) transfer assembly upper end, comprises the fixed support mechanism that is assemblied on the vertical shifting transfer mechanism, is assemblied in the horizontal servo motor mechanism that moves horizontally transfer portion mechanism and supporting setting in the fixed support mechanism; Robot arm is assemblied in to move horizontally and comprises arm main body frame and the supporting paper adsorption unit on the arm main body frame and the drive unit of adsorption unit of being assemblied on the transfer portion mechanism.

In this zone, glass substrate will be finished transverse cutting, loads, weighs, rip cutting, cooling, check, the processing of going up operations such as paper, packing.The realization of each operation process, realize the linking of inter process by automatic conveying system, it is the glass substrate after the crosscut, the process load units is behind transfermatic, deliver to above-mentioned each operation by the control of transfermatic follow procedure, realize the processing of glass substrate work in-process, the production of process segment property before finishing changes the processing of storehouse or postorder over to.Its every equipment (system) all establishes one"s own system, and is an independent body, under native instructions, finishes the work.And the terminal automatic production line of whole annealing furnace is again a unified integral body, and it is under the PLC time variable control, and co-ordination realizes the whole process of this zone to product processing.

Load units is mainly standard equipment and loads the robot device in the post-treatment of the present invention district; Get the paper unit and be mainly the automatic paper extraction unit of special glass substrate; It is conventional equipment that supply unit is mainly automatic transmission system; Transposable element is mainly the standard equipment transposition control device that is arranged on the transmission system; Scribing unit is that disconnected processing machine is broken in the standard equipment line off with the fingers and thumb with breaking disconnected unit off with the fingers and thumb, sets in addition after disconnected processing machine is broken in line off with the fingers and thumb and is equipped with the sampling observation travelling belt; Grinding unit is mainly the standard equipment edge polisher; The standard equipment prewetting machine and the cleaning machine that set gradually before and after cleaning unit comprises, and the input locating device of supporting setting and output locating device, supporting corresponding pipe arrangement and the blowdown system of being provided with of cleaning machine; Break off with the fingers and thumb to set in addition on the disconnected processing machine position in line and be equipped with the sampling observation travelling belt, and connect the manual checking platform, on the position of prewetting machine, set and include two sampling observation travelling belts, and connect the manual checking platform.The automatic paper extraction unit of above-mentioned special glass substrate comprises general frame, be assemblied in slide assemblies on the general frame, be located at the electric control system that the equipment of paper at interval accepted that ground is positioned at slide assemblies integral body below is deposited the power system of paper frame and supporting setting and controlled each parts coordinate operation; Described slide assemblies comprises the straight reciprocating motion unit that is assemblied on the framework, be assemblied in and cooperate the unitary servo drive unit of straight reciprocating motion on the framework, with the paper extraction unit unit that is arranged on the servo drive unit, between servo drive unit and paper extraction unit unit, be equipped with the pendulum device of stretching that the control paper extraction unit is realized upper and lower, transposition action.Wherein the straight reciprocating motion unit comprises reducing motor, driving pulley, driven pulley to described slide assemblies, band, belt wheel pressing plate, slide plate, cable protect chain synchronously, reducing motor as power output is arranged on framework one side, the output shaft of reducing motor is connected with driving pulley, driven pulley is assemblied in the framework opposite side, band is enclosed within on driving pulley and the driven pulley synchronously, band is made as with slide plate and fixedlys connected synchronously, and the slide plate two ends are connected with crossbeam by slide rail; Servo drive unit comprises rail brackets, servo line slideway, horizontal sliding seat, servomotor, ball-screw, a pair of servo line slideway is assemblied on the slide plate bottom by rail brackets, laterally on the sliding seat assembling pair of guide rails, ball-screw is made as with horizontal sliding seat and is threaded, the servomotor mount is in the slide plate bottom, and servomotor is connected with an end of ball-screw by shaft coupling; The paper extraction unit unit is made as vacuum absorption device and is arranged under the horizontal sliding seat, comprises suction pipe, spring plate, mounting blocks, and suction pipe is connected and fixed piece by spring plate, and fixed block is fastened on to be stretched under the pendulum device; Stretch pendulum device and be made as and stretch the pendulum pneumatics, comprise and stretch the pendulum cylinder, connect bent plate, stretch the pendulum cylinder and be connected under the horizontal sliding seat by connecting bent plate.

At post-treatment district production line is the work in-process glass that the annealing furnace end region is produced, and through loading, get paper, transposition, ruling, break off with the fingers and thumb operations such as disconnected, produces the product that meets the requirement of postorder edging.Judge through sampling observation and the line quality of glass to drop into edge polisher then, finish the edge grinding chamfering of glass substrate, and mill cuts out location chamfering and non-location chamfering, eliminate by what line broke that the limit causes off with the fingers and thumb and smallly fall sheet and fine crack, avoid the diffusion of crackle.Glass behind the edging enters prewetting machine, cleaning machine, finish the preceding processing cleaning course of inspection after construction, this is an operation important in the glass processing, and it is coordinated different processing unit unified commands together by the electrical control program, by signal transmission and exchange, realize processing purpose.

Post-treatment district automatic production line is realized by following process: at first, the packaging unit at the work in-process glass place of annealing furnace end region is realized the location in " loaded " position, getting the paper unit takes the glass holding paper away, the glass load units utilizes grabbing device, glass overturn in the packaging unit keep flat on the entrance conveyor, according to the placement direction of glass, can realize the transposition of 90 degree, realize adaptation to various glass loading conditions; Glass substrate enters line and breaks disconnected processing units off with the fingers and thumb under the conveying of travelling belt, and this is the critical process that guarantees glass physical dimension, breaks the glass cullet bar of having no progeny off with the fingers and thumb and enters the cullet catcher collection; The line breaking machine what be provided with later is the sampling observation travelling belt, it can realize to glass at X-ray inspection X, to the line of glass, break disconnected quality off with the fingers and thumb and detect the most timely; Break the glass that breaks after finishing off with the fingers and thumb and enter edge polisher, realize processing, enter prewetting machine, prepare matting through the edge polisher exit conveyor to the glass corner by clamp mechanism, edging wheel, conveying, circular grinding water by entrance conveyor; Include two sampling observation travelling belts on the position of prewetting machine, it can adapt to product and pass in and out production line because of the needs of check or cleaning again.The processing tasks of post-treatment section occupies an important position in whole section, and it accepts the processing tasks of the work in-process of annealing furnace end region to finished product on the one hand, and an other important task is to guarantee the effect of check and be cleaning packing preparatory condition.

To be mainly automatic transmission system be conventional equipment to supply unit in the test package of the present invention district; Temporary storage location is mainly the temporary check-out console of standard equipment; Verification unit comprises the finished product automatic checking system that is located on the production line, is equipped with the sampling observation travelling belt at this station, and it is connected with the manual checking platform; Unloading unit is mainly standard equipment unloading robot; Thereafter final finished packaging unit comprises paper robot and special glass base plate seals packed and transported case in the special use of supporting setting.The glass substrate of above-mentioned special use packs carrying case, it comprises base member, is located at the glass substrate bearing platform on the base member, it is characterized in that: be provided with the glass substrate gripping unit in the plummer bottom, it is made of the supporting rigidity clamp frame on the plummer, the adjustable locking device of adjusting clamp frame and the banded locking strip that has certain tensile to regulate clamp frame of being arranged on; Also be provided with the position-limit mechanism of restriction glass both sides displacement in the both sides of glass plummer; On the glass plummer, also be equipped with the whole guard shield that blocks glass substrate; The scarp of glass substrate bearing platform d2 and vertical surface are provided with the backing plate of damping anti-electrostatic; This glass substrate bearing platform d2 has adopted closed structure; On described glass substrate gripping unit, be provided with cushion plate.

Test package district production line is positioned at the last of total production line, and its glass substrate after with cleaning-drying is transferred to stations such as self-verifying, manual checking, temporary, unloading successively by travelling belt, adopt A type frame to carry out the final finished packing to qualified product then.Though this operation belongs to the non-course of processing,, also play important effect to the control of glass outgoing.Test package district production line is realized by following process: the dried glass substrate of its self-stip is in the future delivered to temporary roll-over table successively by travelling belt, automatic checking system, realize glass at X-ray inspection X, afterwards through being sent to the manual checking platform, realizing off-line check, after the inner quality of glass and surface quality confirmed fully, enter multiple package position, can be to the packing of product according to the different packaging means of requirement employing of using the user.

Its beneficial effect was after the present invention adopted technique scheme: the course of processing that The present invention be directed to glass substrate, a kind of successive automatic production line is provided, it is the strict requirement according to the user, special process process in conjunction with processing, the modern production line that utilizes various processing unitss to form, it absorbs the technical experience of external similar technology and has creatively designed a glass substrate successive automatic production line with independent intellectual property right in conjunction with the practical situation of China domestic enterprise, it has filled up the blank that China does not have liquid-crystalline glasses substrate production line, broken the situation of China to the complete dependence on import of needs of glass substrate, enlarged the scope of domestic flat-panel monitor industry upstream industry chain, blockade for the liquid crystal industry breaks through foreign technology of China, realize the supporting of domestic industry chain, make initiative work.The present invention has passed through actual pilot scale check, and its every index has reached the advanced level of international like product, domestic top standard.

Recently, China’s first 8.5 generation TFT-LCD glass substrate independently developed by Triumph Technology, a company affiliated to the China Building Materials Group, successfully rolled off the production line in Anhui, marking the breakthrough in China’s high-generation TFT-LCD glass substrate. China has now become the third country in the world to master the production technology of high-generation TFT-LCD glass substrates, after the United States and Japan.

TFT-LCD glass substrate (i.e. a glass substrate for the thin-film-transistor liquid-crystal displays), is one of the key strategic materials for the electronic information display industry. Its production control precision is comparable to that of the semiconductor industry, representing the highest level in the field of modern large-scale glass manufacturing in the world. In order to promote the high-quality development of China’s information display industry, the Ministry of Science and Technology has launched a project focusing on “The Development and Industrialization Demonstration of the Core Technology in High-generation Electronic Glass Substrate and Cover Plate” under the key national R&D plan “The Technology Upgrading and Industrialization of Key Basic Materials”, aiming at enhancing the initiative and voice of China’s electronic glass industry in the international market.

TFT-LCD technology is based on semiconductor IC manufacturing processes, and is unique in that it uses glass substrates rather than traditional silicon wafers. For the TFT manufacturing process, thin film formation, such as CVD and PVD processes, is a very important part. The ODF process has been developed for the assembly of color filters and TFT substrates, and is used in large size LCDs.

First of all, the movement and arrangement of liquid crystal molecules need electrons to drive, so in the carrier of liquid crystal – TFT glass, there must be able to conduct the part to control the movement of liquid crystal, here will use ITO (Indium TIn Oxide, transparent conductive metal) to do this thing. ITO is transparent, also known as thin film conductive crystal so that it will not block the backlight.

The different arrangement of liquid crystal molecules and the rapid movement changes to ensure that each pixel accurately display the corresponding color, and the image changes precisely and quickly, which requires precision control of the liquid crystal molecules. ITO film requires special processing, as if printed circuitry on a PCB board, drawing conductive lines throughout the LCD board.

For array panels with back-channel etched TFT structure.The main process can be divided into 5 steps (5 lightings) according to the sequence of the layers to be made and the interrelationship between the layers.

The process includes: Gate layer metal sputtering, Gate lithography, Gate wet lithography, and other processes. After these processes, scan lines and gate electrodes are formed on the glass substrate, i.e. gate electrodes. The graphical representation of the completed process is shown in the following figure.

Photolithography is the process of copying Mask graphic structures onto the glass substrate to be etched. There are three main processes: photoresist coating, exposure, and development

The process includes: PECVD triple layer continuous film formation, island lithography, island dry lithography and other processes. After these processes, the final amorphous silicon island for TFT is formed on the glass substrate. The graphics obtained after the process is completed are shown in the following figure.

PVD (Physical Vapor DeposiTIon), i.e. physical vapor deposition, is an advanced surface treatment technology widely used in the international arena. Its working principle is to use gas discharge to partially dissociate the gas or evaporated material under vacuum conditions, and to deposit the evaporated material or its reactants on the substrate while the gas ions or the evaporated material ions bombard the action. At present, the most used PVD technology on the market is mainly divided into three categories: magnetron sputtering plating, multi-arc ion plating and evaporation plating.

Specific processes include: S/D metal layer sputtering into a film, S/D lithography, S/D wet lithography, channel dry lithography and other processes. After these processes, the source, drain, channel and data lines of the TFT are finally formed on the glass substrate. At this point, the TFT has been produced. The graphics obtained after the process is completed are shown in the following figure.

The process includes PECVD, photolithography, and dry lithography of vias. After these processes, the final TFT channel protective insulation layer and guide through the hole are formed on the glass substrate. The graphics obtained after the process is completed are shown in the following figure.

Specifically, the process includes: sputtering of ITO transparent electrode layer, ITO photolithography, ITO wet lithography and other processes. After these processes, the transparent pixel electrode is finally formed on the glass substrate. The graphics obtained after the process is completed are shown in the following figure.

Color filters can be produced by various methods; photolithography is a typical method. In photolithography, color filters are produced by exposing a glass substrate coated with a photographic color resist through a photomask. The resist is hardened to form the RGB pattern of the LCD.

The middle section of the cell is a combination of the front Array glass as the substrate and the color filter glass substrate, and the liquid crystal (LC) is injected between the two glass substrates.

Rubbing the PI film on top of the glass substrate by using the alignment cloth hairs to create grooves for liquid crystal orientation, so that the liquid crystal is neatly aligned between the upper and lower alignment films in the direction specified.

When making LCD panels it is impossible to produce them one by one, which is too inefficient, so multiple pieces are processed at once and separated by cutting.

COG (Chip on Glass) and FPC (Flexible Printed Circuit) is a circuit connection method. Due to the many electrodes, one-to-one lining connection is very difficult. Nowadays, the common practice is to make an array of leads on the glass and a corresponding array of leads on the IC/FPC, and to connect the electrodes on the IC/FPC to the electrodes on the glass one-to-one through an anisotropic conductive film (ACF). The schematic diagram of the lead electrode array on the glass is as follows.

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